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MAX4649EKA Rev. A
RELIABILITY REPORT FOR MAX4649EKA PLASTIC ENCAPSULATED DEVICES
August 20, 2002
MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord Quality Assurance Reliability Lab Manager
Bryan J. Preeshl Quality Assurance Executive Director
Conclusion The MAX4649 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information IV. .......Die Information V. ........Quality Assurance Information VI. .......Reliability Evaluation ......Attachments
I. Device Description A. General The MAX4649 is a dual-supply, single-pole/double-throw (SPDT) analog switch. On-resistance is 45 max and flat (7 max) over the specified signal range. The MAX4649 can handle Rail-to-Rail(R) analog signals, and conducts analog or digital signals equally well in either direction. This switch operates from a single +9V to +36V supply, or from 4.5V to 20V dual supplies. The primary application areas are in the switching and routing of signals in telecommunications and test equipment. The MAX4649 features a switch transition time of 130ns max at +25C, and a guaranteed break-before-make switching time of 5ns. Off-leakage current is only 2nA max at +25C. The MAX4649 is available in a tiny 8-pin SOT23 package.
B. Absolute Maximum Ratings Item V+ VV+ to VAll Other Pins (Note 1) Continuous Current into any Terminal Continuous Current (COM, NO, NC) Peak Current (COM, NO, NC) (pulsed at 1ms, 10% duty cycle) Operating Temperature Range Storage Temperature Range Junction Temperature Lead Temperature (soldering, 10s) Continuous Power Dissipation (TA = +70C) 8-Pin SOT23 Derates above +70C 8-Pin SOT23 Rating -0.3V to +44.0V -44.0V to +0.3V -0.3V to +44.0V (V- - 0.3V) to (V+ + 0.3V) 10mA 30mA 60mA -40C to +85C -65C to +150C +150C +300C 714mW 8.9mW/C
Note 1: Signals on NO, NC, COM, or IN exceeding V+ or V- are clamped by internal diodes. Limit forward-diode current to maximum current rating.
II. Manufacturing Information A. Description/Function: B. Process: C. Number of Device Transistors: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: Octal 8-Bit Serial DAC with Output Buffer SG5 (Standard 5 micron silicon gate CMOS) 33 Oregon, USA Malaysia January, 2001
III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: 8-Pin SOT23 Copper Solder Plate Silver-filled Epoxy Gold (1.0 mil dia.) Epoxy with silica filler Buildsheet # 05-1201-0218 Class UL94-V0
I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 57 x 43 mils SiN/SiO (nitride/oxide) Aluminum/Si (Si = 1%) None 5 microns (as drawn) 5 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw
V. Quality Assurance Information A. Quality Assurance Contacts: : Jim Pedicord (Reliability Lab Manager) Bryan Preeshl (Executive Director) Kenneth Huening (Vice President)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 100 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate () is calculated as follows: = 1 = MTTF 1.83 (Chi square value for MTTF upper limit) 192 x 4389 x 80 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV = 13.57 x 10-9 = 13.57 F.I.T. (60% confidence level @ 25C)
This low failure rate represents data collected from Maxim's reliability monitor program. I addition to n routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In Schematic (Spec. # 06-5703) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test monitors. This data is published in the Product Reliability Report (RR-1I). B. Moisture Resistance Tests Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard 85C/85%RH testing is done per generic device/package family once a quarter. C. E.S.D. and Latch-Up Testing The AH58 die type has been found to have all pins able to withstand a transient pulse of 400V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of 100mA and/or 20V.
Table 1 Reliability Evaluation Test Results MAX4649EKA
TEST ITEM TEST CONDITION FAILURE IDENTIFICATION PACKAGE SAMPLE SIZE NUMBER OF FAILURES
Static Life Test (Note 1) Ta = 135C Biased Time = 192 hrs. Moisture Testing (Note 2) Pressure Pot Ta = 121C P = 15 psi. RH= 100% Time = 96hrs. Ta = 85C RH = 85% Biased Time = 1000hrs.
DC Parameters & functionality
80
0
DC Parameters & functionality
SOT
77
0
85/85
DC Parameters & functionality
77
0
Mechanical Stress (Note 2) Temperature Cycle -65C/150C 1000 Cycles Method 1010 DC Parameters 77 0
Note 1: Life Test Data may represent plastic D.I.P. qualification lots. Note 2: Generic Package/Process data
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/
Terminal A (Each pin individually connected to terminal A with the other floating) 1. 2. All pins except VPS1 3/ All input and output pins
Terminal B (The common combination of all like-named pins connected to terminal B) All VPS1 pins All other input-output pins
1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 a. b. Pin combinations to be tested. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., V , or V SS1 SS2 or V SS3 or V CC1 , or V CC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open.
Table 1 Reliability Evaluation Test Results
TERMINAL C
R1 S1 R2
TERMINAL A REGULATED HIGH VOLTAGE SUPPLY
S2 C1
DUT SOCKET
SHORT CURRENT PROBE (NOTE 6)
TERMINAL B
R = 1.5k C = 100pf
Mil Std 883D Method 3015.7 Notice 8
TERMINAL D
ONCE PER SOCKET
ONCE PER BOARD
100 OHMS
300 uA + 15 VOLTS
2 mA - 10 VOLTS 2 mA 1 2 3 4 10K OHMS COM NC G V NO VSS IN 8 100 OHMS 7 6
+ 10 VOLTS 300 uA - 15 VOLTS
N/C 5
8 PIN SOT
DEVICES : MAX 4649 MAX. EXPECTED CURRENT= (+/- 15V) 300 uA; (+/- 10V) 2 mA
DRAWN BY: CHRIS JAMBARO NOTES:
DOCUMENT I.D. 06-5703
REVISION A
MAXIM
TITLE: BI
Circuit (MAX 4649)
PAGE
2
OF 3

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